Altera PowerPlay Early Power Estimator Bedienungsanleitung Seite 21

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Figure 3-8: Total Power
Using a Heat Sink
When you use a heat sink, the major paths of power dissipation are from the device through the case,
thermal interface material, and heat sink. There is also a path of power dissipation through the board. The
path through the board has less impact than the path to air.
Figure 3-9: Thermal Representation with a Heat Sink
Heat Sink
Case
Device
Board
Thermal interface material
θ
JA BOTTOM
θ
JC
θ
SA
Thermal Representation with Heat Sink
θ
CS
In the model used in the PowerPlay EPE spreadsheet, power is dissipated through the board or through
the case and heat sink. The junction-to-board thermal resistance (θ
JA BOTTOM
) refers to the thermal
resistance of the path through the board. Junction-to-ambient thermal resistance (θ
JA TOP
) refers to the
thermal resistance of the path through the case, thermal interface material, and heat sink.
UG-01070
2015.01.20
Using a Heat Sink
3-11
PowerPlay Early Power Estimator Worksheets
Altera Corporation
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