
2–66 Chapter 2: Board Components
On-Board Memory
Stratix III 3SL150 Development Board May 2013 Altera Corporation
Reference Manual
Table 2–57 shows the flash sector map.
f For more read and write timing specification, refer to the Intel Corporation website at
www.intel.com.
Table 2–58 lists the flash memory device component reference and manufacturing
information.
FPGA design 7
0x034E.FFFF
0x0000.0000
FPGA design 6
FPGA design 5
FPGA design 4
FPGA design 3
FPGA design 2
FPGA design 1
FPGA design 0 (Default)
Factory design
Table 2–57. Flash Sector Map–Top and Bottom Parameter Dies
Die Stack
Configuration
Size (KBytes)
512-Mbit Flash
(2 × 256 Mbits with 1 CE)
Block Address Range
256-Mbit Top
Parameter Die
32 517
1FFC000
–
1FFFFFF
... ... ...
32 514
1FF0000
–
1FF3FFF
128 513
1FE0000
–
1FEFFFF
... ... ...
128 259
1000000
–
100FFFF
256-Mbit Bottom
Parameter Die
128 258
770000
–
77FFFF
... ...
760000
–
76FFFF
128 4 ...
32 3
010000
–
01FFFF
... ...
000000
–
00FFFF
32 0 ...
Table 2–56. Flash Memory Map (Part 2 of 2)
Name Address
Table 2–58. Flash Memory Device Component Reference and Manufacturing Information
Board Reference Description Manufacturer
Manufacturing
Part Number
Manufacturer
Website
U9 512 Mbit, 1.7 to 2.0 V core, 64-pin BGA Intel Corporation PC48F4400P0VB00 www.intel.com
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